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INTEGRATED CIRCUITS
DATA SHEET
UBA2050(A); UBA2051(A;C) One-chip telephone ICs with speech, dialler and ringer functions
Product specification Supersedes data of 1998 Mar 24 File under Integrated Circuits, IC03 2000 May 19
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
FEATURES Speech/transmission part * Low DC line voltage; operates down to 1.45 V (excluding voltage drop over external polarity guard) * Line voltage regulator with adjustable DC voltage * Regulated 3.3 V supply (VDD) for the dialler part and peripherals compatible with: - Speech mode - Ringer mode - Trickle mode. * Unregulated supply (VCC) for the transmission part and peripherals * Transmit stage with: - Microphone amplifier with symmetrical high-impedance inputs - DTMF input with confidence tone on receive output. * Receive stage with: - Receive amplifier with asymmetrical output - Earpiece amplifier with adjustable gain (and gain boost facility) for all types of earpieces. * AGC: line loss compensation for microphone and receive amplifiers. Dialler part * Last Number Redial (LNR) (32 digits) * Pulse dialling: - 10 PPS and 20 PPS (resistor option) - M/B 2 : 3 and 1 : 2 (resistor option). * DTMF timing: - Manual dialling with minimum duration for bursts and pauses (85/85 ms) - Calibrated timing during redialling (85/85 ms). * Pulse or tone mode select at start-up (resistor option) * Flash function (600, 300, 98 and 80 ms) (resistor options) * Access pause time 2.0 and 3.6 s (resistor option); access pauses in series are possible
UBA2050(A); UBA2051(A;C)
* [/T] key (for mixed mode dialling) or separate [P T] key * Repertory memory integrity check * Keytone generation (only UBA2050, UBA2050A and UBA2051C) * Dial Mode Output (DMO) function during pulse dialling and flash function (only UBA2050 and UBA2051) * LED output for DTMF dialling indication (only UBA2050A and UBA2051A) * Function keys: - [LNR/P], [R] and [P T] - [STORE], [MEM], [M1], [M2] and [M3] (only UBA2051, UBA2051A and UBA2051C). * Resistor options: - [/T] key definition (MMS) - Pulse or Tone mode Selection (PTS) - Flash Time Selection (FTSA and FTSB) - Make/Break ratio Selection (MBS) - Pulses Per Second (PPS) - Access Pause Time (APT). * 13 repertory numbers (only UBA2051, UBA2051A and UBA2051C): - 3 direct memories (21 digits) - 10 indirect memories (21 digits). * Supply and temperature independent tone output * On-chip DTMF filtering for low output distortion ("CEPT CS 203" compatible) * On-chip oscillator suitable for low-cost 3.579545 MHz quartz crystal or ceramic resonator * Uses standard single-contact keyboard * Keyboard entries fully debounced. Ringer part * Ringer input frequency discrimination * 3-tone ringer with 4 programmable melodies (selectable via keyboard by keys [1] to [4]) * 4-level volume control (selectable via keyboard by keys [5] to [8]).
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
GENERAL DESCRIPTION The ICs UBA2050, UBA2050A, UBA2051, UBA2051A and UBA2051C contain all the functions needed to build a fully electronic telephone set. In many places in the text, figures and tables, the description is not applicable for all the five types, but only for one or two or for a combination. These combinations will be referred to by means of short denotations as given in Table 1. Table 1 Denotations of types TYPES UBA2050; UBA2050A UBA2051; UBA2051A; UBA2051C UBA2050; UBA2051 UBA2050A; UBA2051A all five types
UBA2050(A); UBA2051(A;C)
When the line current is high enough, a fixed amount of current is derived from pin LN in order to create a supply point at pin VDD. The voltage at pin VDD is regulated at 3.3 V to supply the dialler and ringer parts and peripheral circuits. Dialler part The dialler and ringer parts of the IC are responsible for the system control, system settings and the generation and detection of various signals. The dialler offers a 32-digit last number redial function. The UBA2051x offers in addition 13 memories (3 direct + 10 indirect) of 21 digits. During pulse dialling the DMO output of the UBA205x can be used to decrease the line voltage. During tone dialling the LED output of the UBA205xA is used to indicate DTMF dialling. A keytone is available if a valid key is pressed for the types UBA2050x and UBA2051C. Ringer part
DENOTATION UBA2050x UBA2051x UBA205x UBA205xA UBA205xx
The devices incorporate a speech/transmission part, a dialler part and a ringer part. By offering a wide range of possible adaptations for each part, the UBA205xx applications can be easily adapted to meet different requirements. Speech/transmission part The speech/transmission part performs all transmission and line interface functions required in fully electronic telephone sets. It performs electronic switching between transmission and dialling. The IC operates at a DC voltage down to 1.45 V (with reduced performance) to facilitate the use of telephone sets connected in parallel. ORDERING INFORMATION
The ringer part offers a discriminator input which enables the MDY/TONE output as soon as a valid ring frequency is detected. It offers a choice of 4 different 3-tone melodies and a 4-level volume control, both programmable via the keyboard. An external very low cost ringer output stage for a buzzer is needed. Stabilized supply (VDD) during ringer mode for dialler and ringer part is included.
PACKAGE TYPE NUMBER NAME UBA2050T UBA2050AT UBA2051T UBA2051AT UBA2051CT SO28 SO28 SO28 SO28 SO28 DESCRIPTION plastic small outline package; 28 leads; body width 7.5 mm plastic small outline package; 28 leads; body width 7.5 mm plastic small outline package; 28 leads; body width 7.5 mm plastic small outline package; 28 leads; body width 7.5 mm plastic small outline package; 28 leads; body width 7.5 mm VERSION SOT136-1 SOT136-1 SOT136-1 SOT136-1 SOT136-1
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
QUICK REFERENCE DATA SYMBOL Speech/transmission part Iline VLN ICC VCC VDD line current operating range DC line voltage internal current consumption supply voltage for internal circuitry (unregulated) regulated supply voltage for peripherals PARAMETER
UBA2050(A); UBA2051(A;C)
CONDITIONS
MIN.
TYP. - - 4.35 1.25 3.6 3.3 3.3 - 44.2 33.4 - 6.0 80
MAX.
UNIT
normal operation with reduced performance Iline = 15 mA VCC = 3.6 V IP = 0 mA speech mode; IDD = -2.6 mA ringer mode; IDD = 75 mA
11 1 4.05 - - 3.0 3.0 - 43.2 32.4 -14
140 11 4.65 1.5 - 3.6 3.6 -2.6 45.2 34.4 +12 - -
mA mA V mA V V V mA dB dB dB dB dB
IDD Gv(TX) Gv(RX) Gv(QR) Gv(trx) Gv(trx)(m) Dialler part
available supply current for peripherals typical voltage gain for microphone amplifier typical voltage gain for receiving amplifier gain setting range for earpiece amplifier gain control range for microphone and receive amplifiers gain reduction for microphone and receive amplifiers VMIC = 4 mV (RMS) VIR = 4 mV (RMS) RE1 = 100 k
Iline = 85 mA; referenced to - Iline = 15 mA in DTMF mode -
VHG(LN)(rms) high group frequency voltage (RMS value) RDTMF1 = 20 k; on line RDTMF2 = 2.74 k VLG(LN)(rms) GV THD Ringer part fring ringer detection frequency low group frequency voltage (RMS value) on line pre-emphasis of group total harmonic distortion RDTMF1 = 20 k; RDTMF2 = 2.74 k
353 277 1.5 - 13
435 341 2.0 -25 -
536 420 2.5 - -
mV mV dB dB
Hz
2000 May 19
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2000 May 19
DIALLER PART R1 R2 R3 R4 C1 C2 C3 C4 KEYBOARD DETECTOR
BLOCK DIAGRAM
Philips Semiconductors
One-chip telephone ICs with speech, dialler and ringer functions
KT
DP/FL
DMO
LED
VDD DTMF
IR
LN
VDD REGULATOR FLASH PULSE DTMF INDICATION VCC
SPEECH/TRANSMISSION PART GAR EARPIECE AMPLIFIER
QR
KEYTONE
MUTE
RECEIVE AMPLIFIER
RX
dB MDY TONE GENERATOR DTMF/ RINGER SLPE TRANSMIT AMPLIFIER
AGC
AGC
5
XTAL CE/CSI CE/FDI TIMING/ CONTROL RINGER PART DETECTOR/ GENERATOR
REG
UBA2050(A); UBA2051(A;C)
SUPPLY
VCC
UBA205xx
FCA138
MDY/TONE UBA2050 and UBA2050A: C4 output not available. UBA2051 and UBA2051A: KT output not available. UBA2050 and UBA2051: DMO output available, LED output not available. UBA2050A and UBA2051A: LED output available, DMO output not available. UBA2051C: KT output available, DMO and LED outputs not available.
MIC+ MIC-
GND
SLPE
Product specification
Fig.1 Block diagram.
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
PINNING PIN SYMBOL UBA2050 LN SLPE REG IR AGC DTMF VDD XTAL DP/FL DMO LED CE/CSI CE/FDI MDY/TONE KT C4 C3 C2 C1 R4 R3 R2 R1 GND QR GAR RX MIC+ MIC- VCC Note 1 2 3 4 5 6 7 8 9 10 - 11 12 13 14 - 15 16 17 18 19 20 21 22 23 24 25 26 27 28 UBA2050A 1 2 3 4 5 6 7 8 9 - 10 11 12 13 14 - 15 16 17 18 19 20 21 22 23 24 25 26 27 28 UBA2051 1 2 3 4 5 6 7 8 9 10 - 11 12 13 - 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
UBA2050(A); UBA2051(A;C)
DESCRIPTION UBA2051A UBA2051C 1 2 3 4 5 6 7 8 9 - 10 11 12 13 - 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 1 2 3 4 5 6 7 8 9 - - 11 12 13 10 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 positive line terminal slope (DC resistance) adjustment line voltage regulator decoupling receive amplifier input automatic gain control and line-loss compensation DTMF transmit input stabilized supply for dialler and ringer parts oscillator input dial pulse/flash output (active LOW) dial mode output DTMF mode indication output chip enable/cradle switch input; note 1 chip enable/frequency discrimination input melody (ringer) output/DTMF generator output keytone output keyboard input/output C4 keyboard input/output C3 keyboard input/output C2 keyboard input/output C1 keyboard input/output R4 keyboard input/output R3 keyboard input/output R2 keyboard input/output R1 negative line terminal earpiece amplifier output gain adjustment earpiece amplifier receive amplifier output non-inverting microphone amplifier input inverting microphone amplifier input supply for speech/transmission part and peripherals
1. The cradle switch and the two positions `handset on the cradle' and `handset lifted' are further on in this document referred to as `hook-switch', respectively `on-hook' and `off-hook' position. 2000 May 19 6
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, halfpage
LN 1 SLPE 2 REG 3 IR 4 AGC 5 DTMF 6 VDD 7
28 VCC 27 MIC- 26 MIC+ 25 RX 24 GAR 23 QR 22 GND
handbook, halfpage
LN 1 SLPE 2 REG 3 IR 4 AGC 5 DTMF 6 VDD 7
28 VCC 27 MIC- 26 MIC+ 25 RX 24 GAR 23 QR 22 GND
UBA2050T
XTAL 8 DP/FL 9 DMO 10 CE/CSI 11 CE/FDI 12 MDY/TONE 13 KT 14
MGT042
UBA2050AT
21 R1 20 R2 19 R3 18 R4 17 C1 16 C2 15 C3 XTAL 8 DP/FL 9 LED 10 CE/CSI 11 CE/FDI 12 MDY/TONE 13 KT 14
MGT043
21 R1 20 R2 19 R3 18 R4 17 C1 16 C2 15 C3
Fig.2 Pin configuration (UBA2050T).
Fig.3 Pin configuration (UBA2050AT).
handbook, halfpage
LN 1 SLPE 2 REG 3 IR 4 AGC 5 DTMF 6 VDD 7
28 VCC 27 MIC- 26 MIC+ 25 RX 24 GAR 23 QR 22 GND
handbook, halfpage
LN 1 SLPE 2 REG 3 IR 4 AGC 5 DTMF 6 VDD 7
28 VCC 27 MIC- 26 MIC+ 25 RX 24 GAR 23 QR 22 GND
UBA2051T
XTAL 8 DP/FL 9 DMO 10 CE/CSI 11 CE/FDI 12 MDY/TONE 13 C4 14
MGT044
UBA2051AT
21 R1 20 R2 19 R3 18 R4 17 C1 16 C2 15 C3 XTAL 8 DP/FL 9 LED 10 CE/CSI 11 CE/FDI 12 MDY/TONE 13 C4 14
MGT045
21 R1 20 R2 19 R3 18 R4 17 C1 16 C2 15 C3
Fig.4 Pin configuration (UBA2051T).
Fig.5 Pin configuration (UBA2051AT).
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
The reference voltage can be increased by connecting the resistor RVA between pins REG and SLPE or decreased by connecting the resistor RVA between pins REG and LN. The voltage at pin REG is used by the internal regulator to generate Vref and is decoupled by capacitor CREG connected between pins REG and GND. This capacitor, converted into an equivalent inductance (see Section "Set impedance"), realizes the set impedance conversion from its DC value (RSLPE) to its AC value (RCC in the audio frequency range). The voltage at pin SLPE is proportional to the line current, and the voltage VLN at pin LN can be calculated as follows: VLN = Vref + RSLPE x ISLPE ISLPE = Iline - ICC - IP - ISUP where: Iline = line current ICC = internal current consumption IP = supply current for peripheral circuits ISUP = current consumed by the VDD regulator from pin LN. Resistor RSLPE is an external resistor connected between pins SLPE and GND. The preferred value for RSLPE is 20 . Changing the value of RSLPE will affect more than the DC characteristics: it also influences the microphone and DTMF gains, the gain control characteristics, the sidetone level and the maximum output swing on the line. The DC current flowing into the set is determined by the exchange supply voltage (Vexch), the feeding bridge resistance (Rexch), the DC resistance of the telephone line (Rline) and the reference voltage (Vref). The excess current is shunted via pin LN to pin SLPE when the line current (Iline) is greater than the sum of the supply current of the speech/transmission part (ICC), the current drawn by the peripheral circuitry connected to VCC (IP) and the input current of the VDD regulator (ISUP). With line currents below Ilow (9 mA), the internal reference voltage (generating Vref) is automatically adjusted to a lower value. This means that more sets can operate in parallel with DC line voltages (excluding the polarity guard) down to an absolute minimum voltage of 1.45 V. At line currents below Ilow, the circuit has limited sending and receiving levels. This is called the low voltage area.
handbook, halfpage
LN 1 SLPE 2 REG 3 IR 4 AGC 5 DTMF 6 VDD 7
28 VCC 27 MIC- 26 MIC+ 25 RX 24 GAR 23 QR 22 GND
UBA2051CT
XTAL 8 DP/FL 9 KT 10 CE/CSI 11 CE/FDI 12 MDY/TONE 13 C4 14
FCA128
21 R1 20 R2 19 R3 18 R4 17 C1 16 C2 15 C3
Fig.6 Pin configuration (UBA2051CT).
FUNCTIONAL DESCRIPTION The values given in the functional description are typical values unless otherwise specified. For numbering of components, refer to Figs 7, 37 and 38. Voltage levels are referenced to the negative line terminal GND, except when otherwise specified. Speech/transmission part SUPPLY The supply for the IC and its peripheral circuits is obtained from the telephone line (see Fig.7).
Line interface (pins LN, SLPE and REG)
The IC generates a stabilized reference voltage Vref between pins LN and SLPE. This reference voltage is 4.15 V, is temperature compensated and can be adjusted by means of an external resistor RVA.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
Internal supply (pin VCC)
The internal transmission part circuitry is supplied from VCC. This supply voltage is derived from the voltage on pin LN by means of resistor RCC and must be decoupled by capacitor CVCC connected between pins VCC and GND. This supply point may also be used to supply peripheral circuits e.g. an electret microphone taking into account the supply possibilities according to Fig.8.
UBA2050(A); UBA2051(A;C)
The voltage VCC (see Fig.9) depends on the current consumed by the transmission part and the peripheral circuits: VCC = VCC0 - RCC x (IP + IREC) where: VCC0 = VLN - ICC x RCC IREC = the current consumed by the output stage of the earpiece amplifier.
handbook, full pagewidth
Rline
Iline
RCC IP LN VCC CVCC 100 F supply electret microphone
SUPPLY TRANSMISSION PART from preamp ISUP ICC IDD
Rexch
VDD REGULATOR
VDD DIALLER/ RINGER
Vexch
REG
SLPE RSLPE 20
GND
UBA205xx
ringerinterface/ peripherals
CREG
4.7 F
ISLPE
CVDD
220 F
FCA129
Fig.7 Supply configuration.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, halfpage
3
MGL827
IP (mA) 2 1.9 mA 1.6 mA
handbook, halfpage RCC
VCC
1
(2) (1)
VCC0
Irec
PERIPHERAL CIRCUITS
IP
0 0 1 2 3 VCC (V) 4
GND
FCA130
VCC 2.5 V; VLN = 4.35 V at Iline = 15 mA; RCC = 619 ; RSLPE = 20 . (1) This curve is valid when the receiving amplifier is not loaded. (2) This curve is valid when the receiving amplifier is loaded; Vo(rms) = 150 mV; RL = 150 .
Fig.8
Typical current IP available from VCC for peripheral circuitry.
Fig.9
VCC used as supply voltage for peripheral circuits.
Regulated supply point (pin VDD)
The VDD regulator delivers a stabilized voltage to supply the internal dialler and ringer parts and peripheral circuits in transmission mode (nominal VLN) and in ringer mode (VLN = 0 V). The maximum supply current for peripherals is 1.9 mA in dialling mode (DTMF generator on) and 2.6 mA in speech mode (DTMF generator off). The supply conditions in ringer and trickle (on-hook condition) modes must not be disturbed by the peripheral supply currents. The regulator (see Fig.7) consists of a sense input circuitry (pin LN), a current switch and a VDD output stabilizer (pin VDD). VDD is decoupled by capacitor CVDD. The regulator function depends on the transmission, ringer and trickle modes as follows: * Transmission mode: The regulator operates as a current source at the LN input; it takes a constant current of ISUP = 4.5 mA (at nominal conditions) from pin LN. The current switch reduces the distortion on the line at large signal swings.
Output VDD follows the DC voltage at pin LN (with typically 0.35 V difference) up to VDD = 3.3 V. The input current of the regulator is constant while the output (source) current is determined by the consumption of the peripherals. The difference between input and output current is shunted by the internal VDD stabilizer. * Ringer mode: The regulator operates as a shunt stabilizer to keep VDD at 3.3 V. The input voltage VLN equals 0 V while the input current into pin VDD is delivered by the ringing signal. * Trickle mode: When VDD is below typically 2 V, the regulator is inhibited. The current consumption of the VDD regulator in trickle mode is very low to save most of the trickle current for memory retention of the dialler and ringer parts.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
Rline
Iline ILN LN
RCC ICC VCC VDD CVCC
100 F IDD
Rexch ISUP
SWITCH SENSE Vexch VDD regulator peripherals
UBA205xx
CVDD GND
220 F
FCA131
Fig.10 VDD regulator configuration.
SET IMPEDANCE In the audio frequency range, the dynamic impedance is mainly determined by resistor RCC. The equivalent impedance of the circuit is illustrated in Fig.11.
LN handbook, halfpage LEQ Vref SLPE RSLPE 20 GND CREG 4.7 F
FCA132
RP REG
RCC 619 VCC CVCC 100 F
LEQ = CREG x RSLPE x Rp. Internal resistance RP = 17.5 k.
Fig.11 Equivalent impedance between LN and GND.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
TRANSMIT STAGES
UBA2050(A); UBA2051(A;C)
In speech mode, the voltage gain from pins MIC+ and MIC- to pin LN is set at 44.2 dB at 600 line load. Microphone arrangements are illustrated in Fig.12. Automatic gain control is provided on this amplifier for line loss compensation.
Microphone signal amplification (pins MIC+ and MIC-)
The UBA205xx has symmetrical microphone inputs. The input impedance between pins MIC+ and MIC- is 64 k (2 x 32 k).
handbook, full pagewidth
(2)
VCC MIC- MIC-
(1)
MIC-
MIC+ MIC+ MIC+ GND
MGT052
a. Magnetic or dynamic microphone.
b. Electret microphone.
c. Piezoelectric microphone.
(1) This resistor may be connected to reduce the terminating impedance. (2) Extra decoupling capacitor for the microphone supply.
Fig.12 Microphone arrangements.
DTMF amplification (pin DTMF)
When the DTMF amplifier is enabled, dialling tones may be sent on the line. These tones are generated at pin MDY/TONE and their amplitude can be adjusted by means of an attenuator and filter network (see Fig.35) before being applied to the DTMF amplifier at pin DTMF. These tones are also sent to the receive output RX at a low level (confidence tone). The UBA205xx has an asymmetrical DTMF input. The input impedance between pins DTMF and GND is 20 k. The voltage gain from pin DTMF to pin LN is set at 26 dB at 600 line load. The DC voltage between pins DTMF and GND is 0 V. So, when an external attenuator/filter network is used, there is no need for a second decoupling capacitor.
The automatic gain control has no effect on the DTMF amplifier. RECEIVE STAGES The receive part consists of a receive amplifier and an earpiece amplifier.
Receive amplifier (pins IR and RX)
The receive amplifier transfers the received signal from input IR to output RX. The input impedance between pins IR and GND is 20 k. The voltage gain from pin IR to pin RX is fixed at 33.4 dB. The RX output is intended to drive high ohmic (real) loads. Automatic gain control is provided on the receive amplifier.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
Earpiece amplifier (pins GAR and QR)
The earpiece amplifier is an operational amplifier having its output QR and inverting input GAR available. It can be used in conjunction with two resistors to get some extra gain or attenuation. Arrangements of the receive and earpiece amplifier are illustrated in Fig.13. Earpiece connections are shown in Fig.14. In the basic configuration (see Fig.13), output RX drives the earpiece amplifier by means of RE1 connected between pins RX and the inverting input GAR. Feedback resistor RGAR of the earpiece amplifier is connected between pins QR and GAR. Output QR drives the earpiece via a series capacitor Cear. The gain of the earpiece amplifier (from RX to QR) can be set between +12 and -14 dB by means of resistor RGAR. The preferred value of RE1 is 100 k. The earpiece amplifier offers a gain boost facility relative to the initial gain. Resistor RGAR has to be replaced by the network of RGAR1, RGAR2 and Rgb and a series capacitor Cgb as shown in Fig.13.
UBA2050(A); UBA2051(A;C)
R GAR1 + R GAR2 V QR The initial gain is defined by: ---------- = - --------------------------------------- - R E1 V RX which corresponds to Rgb = . The gain boost is realised by a defined value of Rgb and is defined by: R GAR1 x R GAR2 ----------------------------------------- R GAR1 + R GAR2 R GAR1 + R GAR2 V QR ---------- = - --------------------------------------- x 1 + ----------------------------------------- R E1 V RX R gb External capacitors CGAR (connected between pins QR and GAR) and CGARS (connected between pins GAR and GND) ensure stability. The capacitor CGAR provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR x RGAR. The value of CGARS must be 10 times the value of CGAR to ensure stability. The output voltages of the earpiece amplifier and the DTMF amplifier are specified for continuous wave drive. The maximum output voltage swing depends on the DC line voltage VLN, the DC resistance RCC of the set-impedance network between pins LN and VCC, the current consumption ICC and IP from pin VCC and the load impedance at pin QR.
handbook, full pagewidth
Cear
Iline
Rline
RCC RGAR ICC LN VCC CGAR RE1 CGARS
earpiece
QR
GAR
RX CVCC 100 F
Rexch EARPIECE AMPLIFIER
Rgb Cgb Vexch RGAR2 0.5VCC RGAR1
CGARS RE1
UBA205xx
GND QR
CGAR GAR RX
Addition for gain boost of earpiece amplifier
FCA133
Fig.13 Receive and earpiece amplifier configuration.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
(1)
(2)
QR
QR
QR
GND
GND
GND
MGT051
a. Dynamic earpiece.
b. Magnetic earpiece.
c. Piezoelectric earpiece.
(1) This resistor may be connected to prevent distortion due to the inductive load. (2) This resistor is required to increase the phase margin due to the capacitive load.
Fig.14 Earpiece connections.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
AUTOMATIC GAIN CONTROL (PIN AGC) The UBA205xx performs automatic line loss compensation. The automatic gain control varies the gain of the microphone amplifier and the gain of the receive amplifier in accordance with the DC line current. The control range is 6.0 dB. This corresponds approximately to the loss for a cable length of 5 km with an 0.5 mm diameter twisted copper-pair, a DC resistance of 176 /km and an average attenuation of 1.2 dB/km).
UBA2050(A); UBA2051(A;C)
The IC can be used with different configurations of exchange supply voltage and feeding bridge resistance by connecting an external resistor RAGC between pins AGC and GND (see Fig.15). This resistor enables the Istart and Istop line currents to be increased (the ratio between Istart and Istop is not affected by the resistor). The AGC function is disabled when pin AGC is left open-circuit.
handbook, full pagewidth
0 Gv (dB) -2
RAGC =
-4
-6
0
10
20
30 k
0
10
20
30
40
50
60
70
80 90 Iline (mA)
100
MGT049
Fig.15 Variation of gain as a function of line current with RAGC as parameter.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
SIDETONE SUPPRESSION The anti-sidetone network for the UBA205xx, comprising RCC in parallel with Zline, Rast1, Rast2, Rast3, RSLPE and Zbal (see Fig.16), suppresses the transmitted signal in the earpiece. Maximum compensation is obtained when the following conditions are fulfilled: RSLPE x Rast1 = RCC x (Rast2 + Rast3) R ast2 x ( R ast3 + R SLPE ) k = ---------------------------------------------------------R ast1 x R SLPE Zbal = k x Zline The scale factor k is chosen to meet the compatibility with a standard capacitor from the E6 or E12 range for Zbal. In practice, Zline varies considerably with the line type and the line length. Therefore, the value of Zbal should be chosen for an average line length, which gives satisfactory sidetone suppression with short and long lines.
UBA2050(A); UBA2051(A;C)
The suppression also depends on the accuracy of the match between Zbal and the impedance of the average line. The anti-sidetone network for the UBA205xx attenuates the received signal from the line by 32 dB before it enters the receive stage. The attenuation is almost constant over the whole audio frequency range. A Wheatstone bridge configuration (see Fig.17) may also be used. More information on the balancing of an anti-sidetone bridge can be obtained in our publication "Application Handbook for Wired Telecom Systems, IC03b".
handbook, full pagewidth
LN
Zline
RCC
Rast1
GND
Im
IR Zir Rast2
RSLPE Rast3 SLPE Z bal
MGT046
Fig.16 Equivalent circuit of UBA205xx anti-sidetone bridge.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
LN
Zline
RCC
Z bal
GND
Im
IR Zir Rast1
RSLPE
RA
SLPE
MGT047
Fig.17 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.
Dialler and ringer parts SUPPLY VOLTAGE (PIN VDD) The power supply must be maintained for repertory memory retention (standby supply voltage) and may drop down to 1.0 V, being the minimum value of the memory retention voltage VMR. Applying a large capacitor across the supply terminals can retain the memory when power connections are broken. The minimum operating voltage is 2.0 V (the Power-on reset voltage VPOR has its maximum value). Below this value, the internal Power-on reset disables the IC. A memory integrity check is performed at each start-up. In the event of a failing check, the memory is cleared. OSCILLATOR (PIN XTAL) The UBA205xx uses an on-chip oscillator as the master timing source. It needs to be completed by an external 3.579545 MHz quartz crystal or ceramic resonator connected between pins XTAL and GND. When using an external ceramic resonator, additional components may be required depending upon the ceramic resonator specifications (refer to the product type specification).
By connecting a capacitor with a value of a few pico-farad in parallel with the resonator, the oscillator frequency can be decreased. By connecting a capacitor with a value of a few ten pico-farad in series with the resonator, the oscillator frequency can be increased. The oscillator starts when VDD reaches the operating voltage level VPOR and pin CE/FDI or pin CE/CSI goes HIGH. Recommended resonator types: Murata CSA 3.58MG300FGA or CSAC 3.58MGC300FGA.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
INTERNAL RESET CIRCUIT (PINS CE/FDI AND CE/CSI) A reset signal is internally generated to initialize the UBA205xx as follows (see Fig.18): * By the on-chip Power-On Reset (POR) circuit as long as VDD is lower than VPOR * When the voltage on pin CE/CSI and on pin CE/FDI are both LOW for a time greater than the reset delay time tRD. When reset conditions are fulfilled, pins MDY/TONE and DP/FL are set to high-impedance; pins DMO, KT, LED, R1 to R4 and C1 to C4 are set to LOW.
UBA2050(A); UBA2051(A;C)
CHIP ENABLE/CRADLE SWITCH INPUT (PIN CE/CSI) To distinguish between different operating states an extra CE/CSI input is used. Comparable to the CE/FDI input, the CE/CSI activates the dialler part. From that moment the dialler part polls this input and the CE/FDI input regularly for line power breaks during on-line states. When pins CE/CSI and CE/FDI are set LOW for a time greater than tRD, the standby state is entered. Pin CE/CSI is set HIGH during the off-hook situation (basic application). The basic states are shown in Table 2. Table 2 UBA205xx basic states INPUT CE/FDI LOW X; note 1 HIGH STATE standby handset ringer; note 2
INPUT CE/CSI LOW
handbook, halfpage
VDD
POR
HIGH LOW
OR reset
Notes 1. Don't care. 2. AC signal at pin CE/FDI. During switching (on-hook/off-hook and pulse dialling) this pin is protected by its ESD diodes. The maximum input current on these diodes should be below 1 mA. RINGER MELODY (PIN MDY/TONE) When an incoming ringer signal at pin CE/FDI is valid, the UBA205xx starts generating a melody via the MDY/TONE output ringer hardware (see Fig.35). The signal at pin MDY/TONE is a square wave signal (see Fig.19). This melody follows the cadence of the ringer signal. Both the melody and the volume can be selected via the keyboard. The melody frequencies and the duration are given in Table 3. Table 8 shows how a melody can be selected by pressing a key during ringing. The melody setting will be stored in the memory. The volume of the ringer circuit can be controlled by changing the amplitude of the square wave. The voltage level at pin MDY/TONE can be changed as shown in Table 9. The volume setting will be stored in the memory. MDY/TONE is a push-pull output. MDY/TONE is high-impedance when VDD < VPOR.
CE/CSI CE/FDI
NOR
MGM334
Fig.18 Internal reset.
CHIP ENABLE AND FREQUENCY DISCRIMINATOR INPUT (PIN CE/FDI) This input is used to activate and initialize part of the system. This pin together with the pin CE/CSI determines which mode to enter (see Table 2) and detects line power breaks during on-line states. To prevent the dialler from reacting on voltage disturbances on the telephone line, a time-out is active. The dialler returns to the standby state if the voltage on both pins CE/CSI and CE/FDI is LOW for a time greater than tRD. In the exchange, several AC signals can be superimposed on the DC signal, e.g. dialling tone, busy tone, disturbances (such as line power breaks) and ringer signal. The ringer signal is evaluated and checked if its frequency is above a specified ringer frequency fring. It is assumed that the frequency at pin CE/FDI is the same as the ringer frequency present on the telephone line. The signal at this pin is half-wave rectified so that the dialler can easily detect zero-crossing, especially at high frequency. During switching (on-hook/off-hook and pulse dialling) this pin is protected by its ESD diodes. The maximum input current on these diodes should be below 1 mA.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
Table 3 Ringer melodies NAME Bell 1 (default) Bell 2 Bell 3 Bell 4 FREQUENCIES (Hz) 770 + 943 + 1341 852 + 943 + 1206 943 + 1206 + 1341 1206 + 1341 + 1482
UBA2050(A); UBA2051(A;C)
DURATION (ms) 28 + 28 + 28 28 + 28 + 28 28 + 28 + 28 28 + 28 + 28
handbook, full pagewidth
VDD GND sync time sample time
CE/FDI
MDY/TONE
MGT050
Fig.19 Ringer frequency detection.
PULSE DIALLER (PINS DP/FL, DMO AND LED) The pulse dialling system uses line current interruptions to signal the digits dialled to the exchange. The number of line current interruptions corresponds to the digit dialled except for the digit [0] which is characterized by 10 interruptions. After each digit there is an inter-digit pause time (tidp). When dialling, the transmission part is muted. The [/T] key definition, the dialling mode, the make/break ratio, repetition rate (pulse dialling), the flash time and the access pause time depend on the resistor options: MMS, PTS, MBS, PPS, FTSA, FTSB and APT (see Fig.25 and Table 7). Valid keys are the digits [0] to [9], [R], [LNR/P], [P T] and [/T] (when MMS resistor option is off). To allow start-up from CVDD discharged, no ESD diode is implemented between pin DP/FL and pin VDD. Pin DP/FL is an open-drain output and is set HIGH (via an external pull-up resistor) when VDD < VPOR.
Pin DMO of the UBA205x is used to enable external hardware (see Fig.37) which decreases the DC voltage over the A and B network exchange terminals during pulse dialling. Several countries require this feature. Pin DMO is a push-pull output and is LOW when VDD < VPOR. Figure 20 shows the timing diagram in pulse dialling mode for the UBA205x when keys [3], [3], [LNR/P] and [4] are pressed. Figure 20 is also valid for the UBA2051C, with the exception of the DMO signal. In pulse dialling mode, pin LED of the UBA205xA is set LOW after off-hook and becomes HIGH when the first DTMF code is sent after switching over to DTMF dialling. Pin LED is a push-pull output and is LOW when VDD < VPOR. Figure 21 shows the timing diagram in pulse dialling mode for the UBA205xA when keys [3], [3], [P T] and [4] are pressed.
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
KEYS internal MUTE
[3].........[3]......... [LNR/P] .........[4]
tb DP/FL tpdp DMO tm
tm tidp
tm tidp
tap
tm tidp tmho
tpdp
tpdp
MGU139
tb = break time. tm = make time. tidp = interdigit pause time.
tap = access pause time. tmho = mute holdover time. tpdp = pre-digit pause.
Fig.20 Timing diagram in pulse dialling mode for the UBA205x.
handbook, full pagewidth
KEYS internal MUTE
....[3] .............. [3] ......... [P->T] ................... [4]
tb
tm tidp
tm tidp
tap tt
tmho
DP/FL tpdp MDY/TONE LED tm tpdp
tp
MGU140
tb = break time. tm = make time. tidp = interdigit pause time. tap = access pause time.
tmho = mute holdover time. tpdp = pre-digit pause. tt = burst time. tp = pause time.
Fig.21 Timing diagram in pulse dialling mode for the UBA205xA.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
TONE DIALLER (PINS MDY/TONE AND LED) The digits are transmitted as two simultaneously generated tones: the Dual-Tone Multi-Frequency (DTMF) system. These dual tones which are provided at the MDY/TONE output are internally generated with two digital sine wave synthesizers together with digital-to-analog converters. Their amplitudes are precisely scaled according to a band gap voltage reference. This ensures tone output levels independent of the supply voltage and temperature. The two sine waves are summed and then filtered by an on-chip switched capacitor filter, followed by an active RC low-pass filter. These guarantee that all DTMF tones generated fulfil the CEPT CS203 recommendations with respect to amplitude, frequency deviation, total harmonic distortion and suppression of unwanted frequency components. Tone digits are separated by a pause time (tp). At dialling, the DTMF input of the transmission part is enabled while the microphone and receive amplifier inputs are disabled. The signal at the DTMF input is sent to the receive output at a low level [see Section "DTMF amplification (pin DTMF)"].
UBA2050(A); UBA2051(A;C)
Valid keys are the digits [0] to [9], [/T], [#], [R], [LNR/P] and [P T]. The dialling mode, the flash time and the access pause time depend on the resistor options: PTS, FTSA, FTSB and APT (see Fig.25 and Table 7). Figure 22 shows the timing diagram in tone dialling mode when keys [3], [3], [LNR/P], [4], [R] and [2] are pressed. In DTMF dialling mode, pin LED of the UBA205xA is set LOW after the hook-switch changes to off-hook and becomes HIGH as soon as a key is pressed and the first DTMF code is sent. Pin LED is a push-pull output and is LOW when VDD < VPOR. The DTMF standard frequencies are implemented as shown in Table 4.
handbook, full pagewidth
KEYS internal MUTE DP/FL
.....[3] ......[3] ..............[LNR/P].......................[4].............. [R] ....................... [2]
tt MDY/TONE
tp
tp
tap
tt
tp
tfl tfho
tifp
tmho tp
high impedance LED
(1)
MGU141
tt = burst time. tp = pause time. tap = access pause time. tfl = flash time. tifp = interflash pause time.
tmho = mute holdover time. tfho = flash holdover time. Note: the maximum tone burst and pause times are equal to the real key press/release time. (1) pin LED only available inUBA205xA.
Fig.22 Timing diagram in tone dialling mode.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
Table 4 DTMF standard frequencies and their implementation FREQUENCY AT MDY/TONE (Hz)(1) 697.90 770.46 850.45 943.23 1206.45 1341.66 1482.21
UBA2050(A); UBA2051(A;C)
DTMF FREQUENCY (Hz) 697 770 852 941 1209 1336 1477 Note
DEVIATION (%) 0.13 0.06 -0.18 0.24 -0.21 0.42 0.35
DEVIATION (Hz) 0.90 0.46 -1.55 2.23 -2.55 5.66 5.21
1. Assuming fxtal = 3.579545 MHz. FLASH FUNCTION (PINS DP/FL AND DMO) Pressing the flash function key [R] results in a calibrated pulse which drives the electronic line current interrupter via pin DP/FL. The DMO output is also activated during pulse production (see Fig.23). After a flash pulse, an interflash pause time tifp of 800 ms is inserted to recover the power supply for the dialler part. The duration of the flash time depends on the resistor options FTSA and FTSB (see Fig.25 and Table 7). During tfl + tfho, the reset delay time is inhibited.
handbook, full pagewidth
KEYS
[R] ............................ [R] ..........................
internal MUTE tfl tifp tfl tifp
DP/FL
DMO(1) tfho tfho
MGU142
(1) pin DMO available only on UBA205x. tfl = flash time. tfho = flash holdover time. tifp = interflash pause time.
Fig.23 Flash timing diagram.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
KEYBOARD DETECTOR (PINS C1 TO C4 AND R1 TO R4) The pins are directly connected to a traditional single contact keyboard. The keyboard is normally static with outputs R1 to R4 at LOW level and inputs C1 to C4 with internal pull-up resistors. When any key is pressed, scanning is done to detect which key has been pressed. A second key entry will be valid after having released the first key entry. Simultaneously pressing several keys will result in no action.
UBA2050(A); UBA2051(A;C)
A key entry becomes valid when the depress debounce time tdd has elapsed (see Fig.24). After the release of a valid key, the scanning is frozen when the release debounce time trd has elapsed. The pins R1 to R4 are LOW and pull-down resistors replace pull-up resistors at pins C1 to C4 when VDD < VPOR.
handbook, full pagewidth
key entry tdd key valid tdd = depress debounce time. trd = release debounce time.
MGM341
trd
Fig.24 Timing diagram debouncing.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
Keyboard structure
UBA2050(A); UBA2051(A;C)
The UBA205xx supports the keyboard structure given in Fig.25. Pin C4 is not available in the UBA2050x. For key definitions, see Table 5.
handbook, full pagewidth
MBS 1 APT 4 PPS 7 PTS 8 9 M2 R3 5 6 M1 R2 2 3 MEM R1
*/T
MMS
0
#
M3
R4
P->T FTSA LNR/P FTSB R
C1
C2
C3
STORE
C4 GND
FCA139
Fig.25 Keyboard structure.
Table 5
Key definitions KEYS DEFINITION [/T](1) digits; see Table 6 switch over to DTMF dialling (mixed mode dialling) last number redial if this key is the first key pressed after going off-hook; access pause if this key is not the first key pressed after going off-hook direct memories indirect memory recall recall (flash function) memory programming
[0] to [9] and [/T](2); [LNR/P] [M1] to [M3] [MEM] [R] [STORE] Notes
[#](1);
[P T]
1. In tone dialling mode. 2. In pulse dialling mode, when MMS resistor option is off (see Table 7).
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
Table 6 Digits keypad activation and corresponding DTMF frequency pairs GENERATED DTMF FREQUENCIES fL (Hz) [0] [1] [2] [3] [4] [5] [6] [7] [8] [9] [#] [/T] Table 7 941 697 697 697 770 770 770 852 852 852 941 941 Resistor functions TO PIN C2 FUNCTION flash time select CONDITIONS FTSB = off; note 2 FTSB = on; note 2 MMS MBS APT PPS PTS Notes 1. On = option resistor present; off = option resistor not present. 2. Pin C3 belongs to resistor option FTSB. C1 R1 R2 R3 R4 [/T] key definition make/break ratio select access pause time select pulses per second pulse/tone select fH (Hz) 1336 1209 1336 1477 1209 1336 1477 1209 1336 1477 1477 1209 NUMBER OF PULSES 10 1 2 3 4 5 6 7 8 9 - -
UBA2050(A); UBA2051(A;C)
Resistor options
The resistors are connected between the pins of the keyboard (C1 to C3 and R1 to R4) and pin GND. One resistor connection is shown in Fig.26. The resistor options are read after each reset of the dialler.
DIGIT KEYS
handbook, halfpage
MBS R1
MGT048
Fig.26 Resistor connection.
RESISTOR FTSA
ON(1) 300 ms 80 ms [/T] becomes [] 33/66 3.6 s 20 pps pulse mode 98 ms 600 ms
OFF(1)
[/T] becomes [P T] 40/60 2.0 s 10 pps DTMF mode
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
KEY TONE (PIN KT)
UBA2050(A); UBA2051(A;C)
A keytone with a frequency fkt = 597 Hz and a duration tkt = 30 ms (see Fig.27) is generated each time a valid key is pressed resulting in the expected action, digit keys in tone dialling mode excepted. Pin KT is a push-pull output and is set LOW when VDD < VPOR.
handbook, full pagewidth
fkt keytone tkt
fkt
tkt = keytone time. fkt = keytone frequency.
tkt
MGM344
Fig.27 Keytones via KT output.
Key sequences The behaviour of the UBA205xx can be represented as a State Transition Diagram (STD). The STD contains the states (rectangles in Fig.28) and state transitions (arrows) of the set. The upper arrow in the figure pointing to the standby state means that the set is initially in the standby state. When, for instance, an incoming call is detected, the set enters the ringer state, waiting for end of a ringer signal or off-hook. If the set goes off-hook, the UBA205xx enters the on-line state. The UBA205xx has 3 basic states: * Standby state * Ringer state * On-line state. Each state with its own functional requirements is described in the following sections. STANDBY STATE In the standby state the UBA205xx is inactive. The current drawn is for memory retention; the loads on the inputs/outputs of the dialler have influence on the retention current.
The UBA205xx leaves the standby state if: * The set goes off-hook (lift handset) * A ringer signal is available on the line. The UBA205xx returns to the standby state if: * The set goes on-hook (handset on-hook) * A line-break occurs with a duration greater than tRD * The ringer signal becomes invalid. RINGER STATE If the set is in standby state, a ringer signal can be received from the line. After evaluating the incoming ringer signal (and the ringer signal is valid), the UBA205xx starts a melody via the MDY/TONE output and ringer hardware; this melody is stopped when the ringer signal is no longer valid. After going off-hook, the ringer signal stops and the set is in the conversation (on-line) state. While ringing, the melody can be changed according to Table 8 and the volume according to Table 9. As long as memory retention conditions are fulfilled, melody and volume are stored.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
power-on
ringer signal STANDBY
off-hook
ringer invalid
on-hook/line break
RINGER off-hook
ON-LINE
MGU186
Fig.28 UBA205xx standby, ringer and on-line states.
Table 8
Melody selection during ringer state MELODY Bell 1 Bell 2 Bell 3 Bell 4 KEY [1] (default) [2] [3] [4]
Table 9 KEY [8] (default) [7] [6] [5]
Ringer volume setting during ringing VOLUME ATTENUATION highest high low lowest 0 dB -6 dB -12 dB -18 dB AMPLITUDE OF MDY/TONE VDD V DD - 0.7 ------------------------ + 0.7 2 V DD - 0.7 ------------------------ + 0.7 4 V DD - 0.7 ------------------------ + 0.7 8
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
ON-LINE STATE This section describes all the actions of the UBA205xx during the on-line state. This state starts with making output DP/FL HIGH (external pull-up resistor), which makes line current flow possible.
UBA2050(A); UBA2051(A;C)
The on-line state contains a number of sub-states (see Fig.29): * Conversation state * Dialling state * Memory recall state * Program state.
handbook, full pagewidth
RINGER
STANDBY
off-hook
off-hook
on-hook/line break
ON-LINE
[LNR/P], [M1 to M3], [MEM] + [0] to [9] [M1 to M3], [MEM] + [0] to [9]
end of recall CONVERSATION [STORE]
dial keys
end
MEMORY RECALL
DIALLING
PROGRAM
MGU187
Fig.29 On-line states.
Conversation state
In this state, conversation is possible.
However when more than 32 digits are dialled the LNR memory will overflow and the last number redial function will be inhibited. There are two dial modes: pulse dialling and tone dialling. The initial dialling mode is determined by resistor option PTS. The state machine which controls the dialling mode is illustrated in Fig.30.
Dialling state
During the dial-key entries the UBA205xx starts immediately with transmission of the digit(s); the minimum transmission time is unaffected by the speed of the entry. Transmission continues as long as further dial-key entries have to be processed.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
CONVERSATION
dial keys
end
PTS = on
PTS = off
PULSE DIALLING
[*/T] or [P->T]
TONE DIALLING
[R] + PTS = on
DIALLING
MGM347
Fig.30 Dialling mode state machine.
* Pulse dialling In this mode all valid keys are dialled by the pulse dialler. When, during pulse dialling, either [/T] when MMS is off or [P T] is pressed, the UBA205xx switches over to tone dialling (mixed mode dialling). After the switch over, valid keys are dialled by the tone dialler. The temporary tone mode is terminated by going on-hook or flash (Recall). * Tone dialling The UBA205xx converts valid key entries into data for the on-chip DTMF generator. Tones are transmitted via output MDY/TONE with a minimum tone burst/pause duration. The maximum tone burst duration is equal to the key pressing time. * Flash function The [R] key will result in pin DP/FL being set to LOW to generate a flash (line current interruption) with a selected time (FTSA and FTSB resistor options). Pressing one digit after [R] key is pressed clears the LNR memory. When going on-hook after the [R] key is pressed, then digits previously dialled in the LNR memory are kept.
* Access pause When the [LNR/P] button is not the first key pressed, an access pause is entered for repertory or redialling procedures. * Last number redial If the first key pressed is [LNR/P], the number stored in the LNR memory is dialled and sent. A maximum number of 32 digits can be stored in the LNR memory. If this maximum is exceeded the redial function is inhibited. Pauses, which are stored in the LNR memory, are also dialled. The tone switch keys [/T] (when MMS is off) and [P T] are also stored in the LNR memory. When a [/T] key (when MMS is on) or [#] key occurs during pulse dialling, its code is not stored in the LNR memory. The LNR memory is always cleared when the [STORE] key is pressed. Its content may also be programmed (see Section "Program state (only UBA2051x)").
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
Memory recall state (only UBA2051x)
Repertory numbers can be dialled out after or before entering manual dialling, last number redial and by entering the memory locations in successive order. Repertory recall is not possible as long as a dial out is pending. The three direct memory locations are numbered [M1] to [M3] and the ten indirect memory locations [MEM] [1] to [MEM] [0]. The stored numbers can be dialled by using one of the following procedures: Press one of the direct memory keys [M1] to [M3] or Press [MEM], followed by one of the numeric keys [1] to [0], corresponding to the memory locations 1 to 10. In case [R] is included in one memory location, when the LNR capacity is exceeded by using it, the LNR function is inhibited.
UBA2050(A); UBA2051(A;C)
- Press [STORE]; the LNR memory is cleared - Press the sequence of digits that must be stored; the keys [0] to [9], [#], [LNR/P], [/T], [P T] or [R] may be used - Store the number in the memory. * Memory overflow If more than 21 digits are entered the old memory contents is kept and the LNR memory is cleared. All the following digits are ignored, except the [STORE] key. The memory overflow state can be left: - By going on-hook - By pressing the [STORE] key again to restart the program sequence. * Clear repertory numbers Clearing a memory location is possible by using the same procedure as for storing a number, except that no telephone number is entered: - Press [STORE]; the LNR memory will be cleared - Press one of the memory keys. * Notepad function In the conversation state it is possible to store a 21 digit number into the LNR memory, which may be dialled after an on-hook/off-hook action. The procedure is as follows: - Press [STORE], the LNR memory will be cleared - Press the sequence of digits that must be stored; the keys [0] to [9], [#], [LNR/P], [/T], [P T] or [R] may be used - Go on-hook/off-hook.
Program state (only UBA2051x)
The program state can be entered from the conversation mode (on-line) when no dial out is pending. Pressing the [STORE] key in this state puts the UBA2051x in the program state and also clears the LNR memory. Pressing the [STORE] key again in the program state will restart the program sequence. * Leaving the program state The program state can be left in one of the following ways: - By going on-hook; the entered digits are stored in the LNR memory - By ending the store procedures properly (see below), resulting in a proper store of the programmed item. * Programming repertory numbers A maximum number of 32 digits can be stored in the memory of repertory numbers (including access pauses, tone switch and flash) and can be achieved by using the following procedure:
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Ptot Tamb Tstg Tj VLN VLN(R) ILN VCC VDD IDD Vn PARAMETER total power dissipation ambient temperature storage temperature junction temperature
UBA2050(A); UBA2051(A;C)
CONDITIONS RSLPE = 20 ; note 1 -
MIN.
MAX. 625 +75 +125 125
UNIT mW C C C V V mA V V mA V
-25 -40 -
Speech/transmission part positive continuous voltage on pin LN repetitive voltage on pin LN during switch-on or line interruption line current supply voltage for the speech/transmission part and peripherals stabilized supply voltage for the dialler and ringer parts input current at pin VDD for the dialler and ringer parts voltage on pins SLPE, IR, REG, AGC, DTMF, RX, QR, GAR, MIC+ and MIC- IDD 75 mA Iline = 0 mA RSLPE = 20 ; note 2 GND - 0.4 12 GND - 0.4 13.2 - 140
GND - 0.4 12 GND - 0.4 3.6 - 75
GND - 0.4 VCC + 0.4
Dialler and ringer parts Vn In Notes 1. Calculated for Tamb = 75 C and Tj = 125 C. 2. Mostly dependent on the maximum required ambient temperature and on the voltage between pins LN and SLPE (see Fig.31). THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note 1. Mounted on glass epoxy board 28.5 x 19.1 x 1.5 mm. PARAMETER thermal resistance from junction to ambient CONDITIONS in free air; note 1 VALUE 70 UNIT K/W voltage on pins 8 to 21 DC sink/source current for pins 8 to 21 GND - 0.4 VDD + 0.4 -10 +10 V mA
2000 May 19
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, halfpage
150
FCA134
ILN (mA) 110
(1) (2) (3)
70
(4)
30
(1) Tamb = 45 C; Ptot = 1.000 W. (2) Tamb = 55 C; Ptot = 0.875 W. (3) Tamb = 65 C; Ptot = 0.750 W. (4) Tamb = 75 C; Ptot = 0.625 W.
2
4
6
8
10 12 VLN -VSLPE (V)
Fig.31 Safe operating area.
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Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
CHARACTERISTICS Iline = 15 mA; GND = 0 V; RSLPE = 20 ; pin AGC connected to GND; Zline = 600 ; f = 1 kHz; fxtal = 3.579545 MHz; Tamb = 25 C; measured according to the test circuits of Figs 32, 33 and 34; see also Figs 37 and 38; unless otherwise specified. SYMBOL Supplies LINE INTERFACE (PIN LN) Iline Vref VLN line current operating range stabilized reference voltage between pins LN and SLPE DC line voltage Iline = 1 mA Iline = 4 mA Iline = 15 mA Iline = 140 mA VLN(Rext) DC line voltage with external resistor DC line voltage variation with temperature external resistor RVA = 44.2 k (between pins LN and REG) normal operation reduced performance 11 1 3.9 - - 4.05 - - - - 4.15 1.45 2.0 4.35 7.1 3.6 140 11 4.4 - - 4.65 7.55 - mA mA V V V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VLN(T)
Tamb = -25 to +75 C; - referenced to Tamb = 25 C VCC = 3.6 V - -
40
-
mV
INTERNAL SUPPLY VOLTAGE (PIN VCC) ICC VCC internal current consumption 1.25 3.6 1.5 - mA V supply voltage for IP = 0 mA speech/transmission part and peripherals
REGULATED SUPPLY VOLTAGE (PIN VDD) ISUP input current of the VDD regulator current from pin LN not flowing through pin SLPE Iline = 1 mA Iline = 4 mA Iline 11 mA VDD regulated supply voltage - - - 0 2.15 4.5 3.3 - - - 3.6 mA mA mA V
speech mode; 3.0 IDD = -2.6 mA; VLN > 3.6 V + 0.25 V (typ.); Iline 11 mA speech mode at reduced performance; Iline = 4 mA ringer mode; Iline = 0 mA; IDD = 75 mA - 3.0
VLN - 0.35 - 3.3 3.6
V V
2000 May 19
33
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
SYMBOL IDD PARAMETER available supply current for peripherals in on-line mode CONDITIONS Iline 11 mA; DTMF generator on; no AC signal on the line Iline 11 mA; DTMF generator off; no AC signal on the line IDD(MR) memory retention current (internal consumption on VDD) memory retention voltage Power-on reset trip level note 1 Iline = 0 mA; VCC discharging; VDD = 1.2 V
UBA2050(A); UBA2051(A;C)
MIN. - -
TYP.
MAX. -1.9
UNIT mA
-
-
-2.6
mA
-
-
300
nA
VDD(MR) VDD(POR)
1.0 1.3
- 1.65
3.6 2.0
V V
Transmit stages MICROPHONE AMPLIFIER (PINS MIC+ AND MIC- AND LN) Zi input impedance differential between pins MIC+ and MIC- single-ended between pin MIC+ or MIC- and GND Gv(TX) Gv(TX) Gv(TX)(f) Gv(TX)(T) CMRR voltage gain from pins MIC+ or MIC- to LN voltage gain reduction of microphone amplifier voltage gain variation with frequency voltage gain variation with temperature common mode rejection ratio Iline = 15 mA; THD = 2% Iline = 4 mA; THD = 10% VMIC = 4 mV (RMS) internal MUTE active f = 300 to 3400 Hz; referenced to f = 1 kHz - - 68 34 - - k k
43.2 - -
44.2 80 0.2 0.3 80 2.15 0.35 -78
45.2 - - - - - - -
dB dB dB dB dB V V dBmp
Tamb = -25 to +75 C; - referenced to Tamb = 25 C - 1.8 -
VLN(max)(rms) maximum sending signal voltage level (RMS value) Vn(LN)
noise output voltage at pin LN psophometrically weighted - (P53 curve); pins MIC+ and MIC- shorted through 200 input impedance voltage gain from pin DTMF to pin LN voltage gain reduction of DTMF amplifier voltage gain variation with frequency in tone dialling mode; VDTMF = 20 mV (RMS) internal MUTE inactive f = 300 to 3400 Hz; referenced to f = 1 kHz - - - -
DTMF AMPLIFIER (PIN DTMF) Zi Gv(DTMF) Gv(DTMF) Gv(DTMF)(f) 21 26 80 0.2 - - - - k dB dB dB
2000 May 19
34
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
SYMBOL PARAMETER CONDITIONS
UBA2050(A); UBA2051(A;C)
MIN.
TYP. 0.4 -9.2 - -
MAX.
UNIT dB dB
Gv(DTMF)(T) voltage gain variation with temperature Gv(ct) voltage gain from pin DTMF to pin RX (confidence tone)
Tamb = -25 to +75 C; - referenced to Tamb = 25 C in tone dialling mode; VDTMF = 20 mV (RMS); RL2 = 10 k; -
Receive stages RECEIVE AMPLIFIER (PINS IR AND RX) Zi Gv(RX) Gv(RX) Gv(RX)(f) Gv(RX)(T) Io(RX)(max) input impedance voltage gain from pin IR to pin RX voltage gain reduction of receive amplifier voltage gain variation with frequency voltage gain variation with temperature maximum source and sink current on pin RX (peak value) VIR = 4 mV (RMS) internal MUTE active f = 300 to 3400 Hz; referenced to f = 1 kHz - 32.4 - - 21.5 33.4 80 0.2 0.3 - - 34.4 - - - - k dB dB dB dB A
Tamb = -25 to +75 C; - referenced to Tamb = 25 C IP = 0 mA; sine wave drive 50
VRX(max)(rms) maximum receiving signal on pin RX (RMS value) Vn(RX)(rms)
IP = 0 mA; sine wave drive; 0.4 without RL2; THD = 2%
- -86
- -
V dBVp
noise output voltage at pin RX pin IR open-circuit; - (RMS value) RL2 = 10 k; psophometrically weighted (P53 curve) - -14
EARPIECE AMPLIFIER (PINS GAR AND QR) Gv(QR) Gv(QR) voltage gain from pin RX to pin QR voltage gain setting range VIR = 4 mV (RMS); RE1 = RGAR = 100 k RE1 = 100 k 0 - 0.38 0.56 -86 - +12 - - - dB dB V V dBVp
VQR(max)(rms) maximum receiving signal on pin QR (RMS value)
IP = 0 mA; sine wave drive; 0.3 RL1 = 150 ; THD = 2% IP = 0 mA; sine wave drive; 0.46 RL1 = 450 ; THD = 2%
Vn(QR)(rms)
noise output voltage at pin QR (RMS value)
IR open-circuit; - RL1 = 150 ; RE1 = RGAR = 100 k; psophometrically weighted (P53 curve) RE1 = 100 k; RGAR = 25 k -
-98
-
dBVp
2000 May 19
35
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
SYMBOL Gv(trx) PARAMETER CONDITIONS
UBA2050(A); UBA2051(A;C)
MIN.
TYP. -
MAX.
UNIT
Automatic gain control (pin AGC) voltage gain control range for microphone and receive amplifiers highest line current for maximum gain lowest line current for minimum gain Iline = 85 mA; referenced to - Iline = 15 mA - - 6.0 dB
Istart Istop
23 59
- -
mA mA
Oscillator (pin XTAL) VXTAL Re(Zi) DC voltage level real part of input impedance of pin XTAL VXTAL = 100 mV (RMS); fxtal = 3.57 MHz - - 0.5VDD -6 - - V k
Control inputs (pins CE/CSI and CE/FDI) VIL VIH ILI VIL VIH IOL IOH1 IOH2 LOW-level input voltage HIGH-level input voltage input leakage current GND < Vi < VDD GND - 0.4 - 0.8VDD -500 0 0.8VDD VOL = 0.15 V VOH = VIH(min) VOL = VIL(max) VOH = VIH(min) VOL = VIL(max) GND < Vi < VDD Vo = 0.15 V Vo = 0.4 V Vo = VDD - 0.15 V 0.7 15 - 30 - -500 1 - - - - 1.6 35 70 80 150 - 2.5 0.2VDD +500 V nA VDD + 0.4 V
Keyboard inputs/outputs (pins C1 to C4, R1 to R4); note 2 LOW-level input voltage HIGH-level input voltage port sink current LOW port pull-up source 1 current HIGH port pull-up source 2 current HIGH 0.2VDD VDD - - 140 - 300 V V mA A A nA nA
Control output (pin DP/FL) ILI IOL IOL IOH input leakage current port sink current LOW +500 - - - nA mA
Control outputs (pins DMO, KT and LED) port sink current LOW port source current HIGH 1.5 -1 4 -2 mA mA
DTMF/ringer output TONE GENERATOR (PIN MDY/TONE); note 3 Io VHG(rms) VLG(rms) GV VDC maximum output current high group frequency voltage (RMS value) low group frequency voltage (RMS value) pre-emphasis of group DC voltage level DTMF mode DTMF mode 70 - - 1.5 - 100 181 142 2.0 0.5VDD - - - 2.5 - A mV mV dB V
2000 May 19
36
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
SYMBOL Zo THD PARAMETER output impedance total harmonic distortion note 4 CONDITIONS
UBA2050(A); UBA2051(A;C)
MIN. - - 353 277
TYP. 100 -25 435 341 -
MAX. 500
UNIT dB
TRANSMIT CHANNEL (PIN LN) VHG(LN)(rms) VLG(LN)(rms) high group frequency voltage (RMS value) low group frequency voltage (RMS value) RDTMF1 = 20 k; RDTMF2 = 2.74 k RDTMF1 = 20 k; RDTMF2 = 2.74 k VDD = 3.3 V; note 5 Key [8] Key [7] Key [6] Key [5] Notes 1. When this level is reached at rising VDD, the internal reset signal is deactivated. There is no hysteresis in the switching level, only hysteresis in the time domain. 2. At start-up the output has a pull-up source IOH2 for detection of the resistor options. After initializing the output pull-up source will be IOH1. 3. MDY/TONE has three modes: a) In speech mode or DTMF mode: 0.5VDD output. b) In ringer mode: push-pull output stage. c) In standby mode: high-impedance output. 4. Related to the low group frequency component (CEPT CS203 compatible). 5. In the event of a valid ringer signal present at pin CE/FDI. - - - - 3.2 2.0 1.4 1.1 - - - - V V V V 536 420 mV mV
MDY output (pin MDY/TONE) Vo(p-p) ringer volume output voltage (peak-to-peak value)
2000 May 19
37
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
TIMING CHARACTERISTICS SYMBOL Timing KEYBOARD INPUTS/OUTPUTS (PINS C1 TO C4 AND R1 TO R4) tdd trd keyboard depress debounce time keyboard release debounce time PARAMETER CONDITIONS
UBA2050(A); UBA2051(A;C)
MIN.
TYP.
MAX.
UNIT
- -
20 20
- -
ms ms
KEY TONE OUTPUT (PIN KT) tkt fkt tidp tfho tmho tap keytone time keytone frequency - - dialling rate 10 pps dialling rate 20 pps flash holdover time mute holdover time access pause time resistor APT is not present resistor APT is present tifp tpdp tm interflash pause time pre-digit pause make time dialling rate 10 pps resistor MBS is not present resistor MBS is present dialling rate 20 pps resistor MBS is not present resistor MBS is present - - 20 16 - - ms ms - - 40 33 - - ms ms - - - - - - - - 30 597 - - - - - - - - - - ms Hz
DIAL PULSE/FLASH OUTPUT (PIN DP/FL) interdigit pause time 800 500 40 15 2.0 3.6 800 40 ms ms ms ms s s ms ms
2000 May 19
38
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
SYMBOL tb PARAMETER brake time CONDITIONS dialling rate 10 pps resistor MBS is not present resistor MBS is present dialling rate 20 pps resistor MBS is not present resistor MBS is present tfl flash time resistor FTSB is not present resistor FTSA is not present resistor FTSA is present resistor FTSB is present resistor FTSA is not present resistor FTSA is present DIAL TONE OUTPUT (PIN MDY/TONE) tt tp tRD Timing fring td(res)(ring) ringer detection frequency ringer response delay <1.5 frequency cycle; VDD > VPOR burst time pause time
UBA2050(A); UBA2051(A;C)
MIN. - - 60 66
TYP. - -
MAX.
UNIT ms ms
- -
30 33
- -
ms ms
- -
98 300
- -
ms ms
- -
600 80
- -
ms ms
- - - 13 -
85 85
- - - - 150
ms ms
CHIP ENABLE INPUTS (PINS CE/CSI AND CE/FDI) reset delay time 280 - - ms
Hz ms
2000 May 19
39
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
TEST AND APPLICATION INFORMATION
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
CVDD Iline VLN RCC 619 CE/CSI IR 100 F VMIC MIC+ DP/FL MIC- LN C2 C3 R2 R3 R4 VCC ICC VDD QR RGAR CGAR CGARS RE1 100 k RX AGC SLPE GND C1 S1 X1 3.58 MHz R1 XTAL 100 nF RL2 10 k
FCA135
220 F IDD
CVCC 100 F Cear
R L1
UBA205xx
MDY/TONE DTMF REG
GAR CE/FDI
Iline
VO
Zline
600
VDTMF
CREG 4.7 F
RSLPE 20
VO Voltage gain defined as Gv = 20 log ------ ; VI = VMIC or VDTMF. VI Microphone gain: S1 = open. DTMF gain and confidence tone: S1 = closed. Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin 4 must be open-circuit.
Fig.32 Test circuit for defining transmit gains.
2000 May 19
40
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
CVDD VLN RCC 619 ICC CE/CSI IR LN C2 C3 R2 R3 R4 VCC VDD QR RGAR CGAR CGARS RE1 100 k IDD 220 F C VCC 100 F VQR Cear R L1
Iline
100 F 220 nF VI Iline Zline CDTMF 100 nF RDTMF1 20 k
DP/FL MIC- MIC+ MDY/TONE DTMF REG AGC SLPE GND C1 S1 X1 3.58 MHz R1
UBA205xx
GAR CE/FDI RX XTAL
100 nF R L2 10 k
600
RDTMF2 2.74 k
CREG 4.7 F
RSLPE 20
FCA136
VO Voltage gain defined as Gv = 20 log ------ ; VO = VQR or VRX. VI Receive and earpiece gains: S1 = open. Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin R4 must be open-circuit.
Fig.33 Test circuit for defining receive gains and DTMF dialling levels.
2000 May 19
41
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
RCC 619 C2 C3 R2 R3 R4 IR MIC- GAR MIC+ CE/CSI CE/FDI MDY/TONE RX DP/FL REG AGC SLPE GND C1 R1 XTAL VDD 10 F IDD LN VCC VDD QR
VCC
DTMF
UBA205xx
CREG 4.7 F
RSLPE 20
X1 3.58 MHz
FCA137
Inputs not being tested should be open-circuit. Only pins common to UBA205xx are represented. Pin R4 must be open-circuit.
Fig.34 Test circuit for defining regulated supply (VDD) performance in ringer and trickle mode.
2000 May 19
42
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
Rprot 3.9 TR2 BC558 Z2 BZX79C (8.2 V) R2 R1 470 k TR3 BF420 R3 S1-2 C 470 k
TR1 BSP254A BZD23C (10 V) or BZV85C (10 V)
RCC 620 R ast1 130 k Cir 100 nF R ast2 3.92 k Rast3 392 R bal1 130 RSLPE 20 LN 1 A
Z1
R bal2 470 k RCSI 470 k
820
Cbal 220 nF
SLPE
2
REG
3
S1-1 C Rtrickle 15 M Cring Rring A/B 1 F D1 BR211 (220 V) 2.2 k (2 W) D2 BAS11 D3 BAS11 CVDD D4 BAS11 D5 BAS11 220 F (16 V) CREG
4.7 F (25 V)
IR
4
AGC
5
DTMF
6
VDD
7
B/A
IC1
XTAL X1 3.58 MHz DP/FL 9 8
Z4 BZX79C (18 V)
RFDI 470 k R4 R6 100 k Z5 BZX79C 100 k (16 V) D6 BAS45 Rdtmf1 20 k Rdtmf2 2.74 k Cdtmf 100 nF 220 k
DMO
10
CE/CSI
11
CE/FDI
12
R5 + TR4 BC547
MDY/TONE
13
H1 ringer
KT H2 keytone +
14
Cvrr
22 F (35 V)
TR5 BC557 TR6 BC547 Rvol 12 k
Rmdy 100 k
MGT053
Fig.35 Application of the UBA2050 (continued in Fig.36).
2000 May 19
43
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
A R feed CVCC 100 F (10 V) C feed 1 k
47 F (25 V)
Rmicp 28 VCC
1 k
27
MIC- R tx3
C tx1 18 nF 8.2 k C tx2 18 nF
R tx1 22 k R tx2 22 k Rmicm 1 k
+
MIC1
26
MIC+
25
RX
RE1 100 k
CGARS 1 nF RGAR
24
GAR CGAR
47 k 100 pF 10 F (16 V)
23
QR Cear
22
GND
earpiece
IC1
21 R1
1
2
3
4
5
6
20
R2
7 8 9
R3 19
*/T
18 R4
P->T
0
#
17
C1
LNR/P
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
MBS APT PPS PTS MMS FTSA FTSB 1 M (7x)
RMBS RAPT RPPS RPTS RMMS RFTSA RFTSB
12345678
16
C2
R
15
C3
MGT054
Fig.36 Application of the UBA2050 (continued from Fig.35).
2000 May 19
44
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
Rprot 3.9 TR2 BC558 Z2 BZX79C (8.2 V) R2 R1 470 k TR3 BF420 R3 S1-2 C 470 k
TR1 BSP254A BZD23C (10 V) or BZV85C (10 V)
RCC 620 Z3 BZX79C (4.3 V) R ast1 130 k Cir TR7 BSN254A RDMO 470 k DMO R ast2 3.92 k Rast3 392 R bal1 130 RSLPE 20 Cbal 220 nF LN 1 100 nF A
Z1
R bal2 220 k RCSI 470 k
820
SLPE
2
REG
3
S1-1 C Rtrickle 15 M Cring A/B 1 F D1 BR211 (220 V) Rring 2.2 k (2 W) D2 BAS11 D3 BAS11 CVDD D4 BAS11 D5 BAS11 220 F (16 V) CREG
IR
4
AGC
5
DTMF
6
VDD
7
B/A
IC1
XTAL X1 3.58 MHz DP/FL 9 8
Z4 BZX79C (15 V)
RFDI DMO 470 k R4 R6 100 k Z5 BZX79C (16 V) D6 BAS45 Rdtmf2 2.74 k Rdtmf1 20 k Cdtmf 100 nF 220 k
DMO
10
CE/CSI
11
CE/FDI
12
R5 + TR4 BC547
100 k
MDY/TONE
13
H1 ringer
C4 TR5 BC557 TR6 BC547 Rvol 12 k
14
Cvrr
22 F (35 V)
Rmdy 100 k B
MGT055
Fig.37 Application of the UBA2051 (continued in Fig.38).
2000 May 19
45
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
handbook, full pagewidth
A R feed C VCC 100 F (10 V) C feed 1 k
47 F (25 V)
Rmicp 28 VCC
1 k
27
MIC- R tx3 8.2 k
C tx1 18 nF C tx2 18 nF
R tx1 22 k R tx2 22 k Rmicm 1 k + MIC1
26
MIC+
25
RX
RE1 100 k
CGARS 1 nF
24
GAR CGAR 100 pF 10 F (16 V)
RGAR1 22.1 k
Cgb 1 F (50 V)
23
QR Cear
RGAR2 22.1 k
22
GND
MEM
earpiece
S3
IC1
21 R1
1
2
3
M1
4
5
6
Rgb1 18.2 k
Rgb2 7.15 k
Rgb3 3.65 k
20
R2
M2 7 8 9
GAIN BOOST 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 MBS APT PPS PTS MMS FTSA FTSB 1 M (7x) RMBS RAPT RPPS RPTS RMMS RFTSA RFTSB
R3 19
M3
12345678
*/T
0
#
18
R4
P->T
17
C1
LNR/P
16
C2
R
15
C3
STORE
C4
MGT056
B
Fig.38 Application of the UBA2051 (continued from Fig.37).
2000 May 19
46
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm
UBA2050(A); UBA2051(A;C)
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013 EIAJ EUROPEAN PROJECTION A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
ISSUE DATE 97-05-22 99-12-27
2000 May 19
47
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
UBA2050(A); UBA2051(A;C)
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2000 May 19
48
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
UBA2050(A); UBA2051(A;C)
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable
2000 May 19
49
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development
UBA2050(A); UBA2051(A;C)
DEFINITIONS (1) This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 May 19
50
Philips Semiconductors
Product specification
One-chip telephone ICs with speech, dialler and ringer functions
NOTES
UBA2050(A); UBA2051(A;C)
2000 May 19
51
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
403502/02/pp52
Date of release: 2000
May 19
Document order number:
9397 750 06723

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